As the world's leading integrated circuit manufacturing and technical service provider, Changdian technology provides a full range of one-stop services for the manufacturing of finished chip products, including system integration, design simulation, technology development, product certification, in-process wafer testing, wafer level mid-channel packaging testing, system level packaging testing, and finished chip testing of integrated circuits, and can provide drop shipment services to semiconductor customers all over the world.

Through highly integrated wafer level packaging (WLP), 2.5d/3d packaging, system level packaging (SIP), high-performance flip chip packaging and advanced wire bonding technology, the products, services and technologies of Changdian technology cover the application of mainstream integrated circuit systems, including network communication, mobile terminals, high-performance computing, vehicle electronics, big data storage, artificial intelligence, Internet of things, industrial intelligent manufacturing and other fields. Changdian technology has more than 23000 employees worldwide, six production bases and two R & D centers in China, South Korea and Singapore, and business institutions in more than 23 countries and regions. It can carry out close technical cooperation with global customers and provide efficient industrial chain support.